*Question E6E11:
What is a characteristic of DIP packaging used for integrated circuits?*  

*Correct Answer is  D: Two rows of connecting pins on opposite sides of package (dual in-line package)*  

### AI Response: (may contain errors)  

DIP packaging, or Dual In-line Package, is a common type of packaging for integrated circuits. Here's why the correct answer is correct and the others are not:

1. **Correct Answer: D - Two rows of connecting pins on opposite sides of package (dual in-line package)**
   - **Explanation**: The term "dual in-line package" refers to the physical layout of the package. It has two parallel rows of pins that extend perpendicularly from the body of the package. This design allows the package to be easily inserted into a socket or soldered onto a printed circuit board (PCB).

2. **Incorrect Choices**:
   - **A: Extremely low stray capacitance (dielectrically isolated package)**
     - **Explanation**: While minimizing stray capacitance is important in IC design, it is not a defining characteristic of DIP packaging. Dielectrically isolated packages are a different type of packaging that specifically addresses electrical isolation, not the physical layout.
   - **B: Extremely high resistance between pins (doubly insulated package)**
     - **Explanation**: High resistance between pins is not a characteristic of DIP packaging. The term "doubly insulated package" is not a standard term in IC packaging and does not describe the physical layout of a DIP.
   - **C: Two chips in each package (dual in package)**
     - **Explanation**: The term "dual in package" is misleading. DIP refers to the pin configuration, not the number of chips inside the package. A DIP can contain one or more chips, but the name itself does not imply multiple chips.

In summary, the defining feature of a DIP is its two rows of pins, which makes it easy to identify and use in electronic circuits.