Question E6E02:
Which of the following device packages is a through-hole type?  

Choices:  
A: DIP  
B: PLCC  
C: BGA  
D: SOT    

Correct Answer is  A: DIP  

Correct Answer: DIP

1) Why DIP is correct
- DIP = Dual In-line Package. It has two parallel rows of leads designed to go through holes in the PCB or into sockets.
- Typical lead pitch is $0.1\,\text{in}$ ($2.54\,\text{mm}$), common in through-hole prototyping (perfboard, breadboards).

2) Why the others are incorrect
- PLCC (Plastic Leaded Chip Carrier): Surface-mount package with J-leads that fold under the body. While you can use a through-hole PLCC socket, the device itself is an SMD package.
- BGA (Ball Grid Array): Surface-mount only; uses solder balls underneath the package for reflow soldering.
- SOT (Small Outline Transistor): Surface-mount family (e.g., SOT-23) with small gull-wing leads; not intended for through-hole.

3) Useful rules of thumb
- Through-hole package names you’ll commonly see: DIP, SIP, TO-92, TO-220; typical lead spacing $0.1\,\text{in}$ ($2.54\,\text{mm}$).
- Surface-mount package prefixes often include: SO-, SOT-, QFP, QFN, PLCC, BGA. These use gull-wing, J-leads, or solder balls and do not pass through the board.