*Question E6E11:
What is a characteristic of DIP packaging used for integrated circuits?*  

*Correct Answer is  D: Two rows of connecting pins on opposite sides of package (dual in-line package)*  

### AI Response: (may contain errors)  

The correct answer to the question about DIP packaging is:

**D: Two rows of connecting pins on opposite sides of package (dual in-line package)**

### Explanation of the Correct Answer:
- **Dual In-Line Package (DIP)** is characterized by having two parallel rows of pins that connect to a circuit board. This design allows for easy insertion into a socket or soldering onto a PCB (Printed Circuit Board). The layout facilitates efficient use of space and simplifies the manufacturing process.

### Why the Other Choices are Incorrect:
- **A: Extremely low stray capacitance (dielectrically isolated package)**  
  - This statement is misleading. While some packaging types may have low stray capacitance, DIP packages do not specifically feature dielectrically isolated designs. Stray capacitance is more related to the physical layout and materials used rather than the DIP design itself.

- **B: Extremely high resistance between pins (doubly insulated package)**  
  - This is incorrect because DIP packages do not inherently provide high resistance between pins. The term "doubly insulated" refers to a different type of insulation standard, not a characteristic of DIP packaging.

- **C: Two chips in each package (dual in package)**  
  - This choice is incorrect because a standard DIP typically contains a single integrated circuit (IC). While there are multi-chip packages, they are not referred to as DIP.

### Summary:
- The defining feature of a DIP is its two rows of pins, which is why option D is correct. Understanding the physical characteristics of different IC packages is crucial for the Extra Class exam, as it relates to circuit design and implementation.