*Question E6E02:
Which of the following device packages is a through-hole type?*  

*Correct Answer is  A: DIP*  

### AI Response: (may contain errors)  

In the context of electronic components, a "through-hole" package refers to a type of component that is mounted by inserting its leads through holes in a printed circuit board (PCB) and soldering them on the opposite side. Let's examine the options:

1. **DIP (Dual In-line Package)**:
   - **Correct Answer**: DIP is a through-hole package. It has two parallel rows of pins that are inserted into holes on a PCB. This package is commonly used for integrated circuits and is easily recognizable by its rectangular shape and two rows of pins.

2. **PLCC (Plastic Leaded Chip Carrier)**:
   - **Incorrect**: PLCC is a surface-mount package, not a through-hole. It is designed to be mounted directly onto the surface of a PCB without the need for holes. PLCCs have leads that wrap around the sides of the package.

3. **BGA (Ball Grid Array)**:
   - **Incorrect**: BGA is also a surface-mount package. It uses an array of solder balls on the underside of the package to connect to the PCB. This type of package is used for high-density connections and does not involve through-hole mounting.

4. **SOT (Small Outline Transistor)**:
   - **Incorrect**: SOT is another surface-mount package. It is used for transistors and other small components. SOT packages are soldered directly onto the surface of the PCB.

**Summary**:  
- **DIP** is the only through-hole package among the options, making it the correct answer.
- **PLCC**, **BGA**, and **SOT** are all surface-mount packages, which do not use through-hole mounting.