*Question E6E02:
Which of the following device packages is a through-hole type?*  

*Correct Answer is  A: DIP*  

### AI Response: (may contain errors)  

The correct answer to the question about which device package is a through-hole type is:

**A: DIP (Dual In-line Package)**

### Explanation:

1. **Why the correct answer is correct:**
   - A DIP is a type of electronic component package that has two parallel rows of pins. These pins are designed to be inserted into holes on a printed circuit board (PCB) and soldered in place, making it a classic example of a through-hole package.

2. **Why the other choices are incorrect:**
   - **B: PLCC (Plastic Leaded Chip Carrier)**: This package has leads that extend from the sides and are designed for surface mounting, not through-hole mounting.
   - **C: BGA (Ball Grid Array)**: This package uses a grid of solder balls on the bottom for mounting directly onto the PCB surface, making it a surface mount technology (SMT) package.
   - **D: SOT (Small Outline Transistor)**: This is also a surface mount package with leads that extend from the sides, designed for mounting on the surface of a PCB.

### Summary:
- **Through-hole packages**: DIP
- **Surface mount packages**: PLCC, BGA, SOT

Understanding the differences between these package types is crucial for selecting the right components for your projects and for the Extra Class exam.