Question E6E11:
What is a characteristic of DIP packaging used for integrated circuits?  

Choices:  
A: Extremely low stray capacitance (dielectrically isolated package)  
B: Extremely high resistance between pins (doubly insulated package)  
C: Two chips in each package (dual in package)  
D: Two rows of connecting pins on opposite sides of package (dual in-line package)    

Correct Answer is  D: Two rows of connecting pins on opposite sides of package (dual in-line package)  

Correct answer: D — Two rows of connecting pins on opposite sides of package (dual in-line package)

1) Why D is correct
- DIP stands for Dual In-line Package.
- It has two parallel rows of through-hole pins on opposite sides of a rectangular body.
- Common features: $0.1$ inch ($2.54$ mm) pin pitch; row spacing typically $0.3$ or $0.6$ inch.

2) Why the other choices are incorrect
- A: “Dielectrically isolated package” is not what “DIP” means. DIP does not imply extremely low stray capacitance; in fact, lead length and lead frame add parasitic capacitance and inductance.
- B: “Doubly insulated package” is not a DIP attribute. DIPs do not guarantee extremely high resistance between pins; there is finite leakage and contamination can lower resistance.
- C: “Dual in package” (two chips) is not what DIP means. While some DIPs may contain dual op-amps, the “dual” in DIP refers to two in-line rows of pins, not two chips.

3) Useful rules of thumb
- DIP pin pitch: $0.1$ inch ($2.54$ mm).
- Typical body row spacing: $0.3$ inch (narrow DIP) or $0.6$ inch (wide DIP).
- Pin 1 is marked by a notch or dot; numbering proceeds counterclockwise when viewed from the top.